PZT on thin metallic foil

Deposition method: Sputtering

Piezoelectric film on Metallic substrates

Due to the good integration into existing processing technologies, platinized silicon wafers are commonly used as substrates. However, many applications are showing the need to utilize other substrates than silicon wafers. Metallic foils offer several advantages like higher toughness, more adapted thermal expansion, and eventually a better chemical compatibility, as compared to silicon based materials such as crystalline silicon, nitride membranes, etc. At PIEMACS our capabilities extend to deposition of piezoelectric thin films not only on metalized Si substrate but also metallic substrate.­


  • Designing of the processes
  • Deposition of piezoelectric thin films
  • Characterization of piezoelectric properties of piezoelectric laminated foil

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